Sn はんだとCuの界面での反応拡散におけるAgとBi添加の影響

Publication Information

Title

Japanese:	Sn はんだとCuの界面での反応拡散におけるAgとBi添加の影響
English:	Effects of Ag and Bi additions on growth kinetics of intermetallic compounds

Author

Japanese:	徳永成琉, OH Minho, 小林郁夫.
English:	Naru Tokunaga, Minho O, Equo Kobayashi.

Language

Japanese

Journal/Book name

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Volume, Number, Page

Published date

Sept. 2024

Publisher

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Conference name

Japanese:	日本金属学会2024年秋季講演大会
English:

Conference site

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