The International Conference on Computational Methods (ICCM)
開催地
和文:
英文:
Cambridge
アブストラクト
A new meshfree numerical analysis, termed the seamless domain method (SDM), is applied in a
multiscale technology. The SDM requires only coarse-grained points and does not need a stiffness
equation, mesh, grid, cell, or element. The SDM is composed of two analyses. The first is a
microscopic analysis of local simulation domain to obtain shape functions for interpolation of
dependent-variable distributions and influence coefficients for calculation of interaction between
the points. These allow an SDM solution to represent a heterogeneous material without
homogenization. The second step is a macroscopic analysis of a seamless global domain without
mesh or grid. Various numerical examples illustrated that the method worked out both steady
temperature fields and linear elastic fields. Every SDM solution using only a few hundreds of points
was as accurate as that from conventional finite element analysis using more than 200 thousands of
node points.