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タイトル
和文: 
英文:Contactless electrical conductivity measurement of metallic submicron-grain material: Application to the study of aluminum with severe plastic deformation 
著者
和文: 美藤正樹, H. Matsui, T. Yoshida, T. Anami, K. Tsuruta, H. Deguchi, T. Iwamoto, 寺田大将, 宮嶋 陽司, 辻 伸泰.  
英文: M. Mito, H. Matsui, T. Yoshida, T. Anami, K. Tsuruta, H. Deguchi, T. Iwamoto, Daisuke Terada, Y. Miyajima, N. Tsuji.  
言語 English 
掲載誌/書名
和文: 
英文:Review of Scientific Instruments 
巻, 号, ページ Volume 87    Number 5   
出版年月 2016年5月26日 
出版者
和文: 
英文:AIP publishing 
会議名称
和文: 
英文: 
開催地
和文: 
英文: 
DOI https://doi.org/10.1063/1.4950868
アブストラクト We measured the electrical conductivity σ of aluminum specimen consisting of submicron-grains by observing the AC magnetic susceptibility resulting from the eddy current. By using a commercial platform for magnetic measurement, contactless measurement of the relative electrical conductivity σ n of a nonmagnetic metal is possible over a wide temperature (T) range. By referring to σ at room temperature, obtained by the four-terminal method, σ n(T) was transformed into σ(T). This approach is useful for cylinder specimens, in which the estimation of the radius and/or volume is difficult. An experiment in which aluminum underwent accumulative roll bonding, which is a severe plastic deformation process, validated this method of evaluating σ as a function of the fraction of high-angle grain boundaries.

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