"Md. M. Hasan,T. Huang,M. Saito,Y. Takamura,P. Allongue,T. Homma","Seed Layer Effect on Electrodeposited 3D CoPt Alloy Nanowires for Magnetic Storage Application","PRiME 2024 Joint International Meeting",,," C04-1651",,,2024,Oct. "Y. Takamura,T. Huang,Y. Tanaka,Md. M. Hasan,M. Saito,S. Nakagawa","3ŽŸŒ³Ž¥‹Cƒƒ‚ƒŠ‰ž—p‚ÉŒü‚¯‚½CoPt“dÍ–Œ‚ÌŽ¥‰»“Á«‚Ì–ŒŒúˆË‘¶«","‘æ48‰ñ“ú–{Ž¥‹CŠw‰ïŠwpu‰‰‰ï",,," 26aB-11",,,2024,Sept. "Ö“¡”ü‹IŽq,Md. M. Hasan,‰©“¶™Ô,‚‘º—z‘¾,–{ŠÔŒh”V","ƒeƒ“ƒvƒŒ[ƒg–@‚ð—p‚¢‚½Co-Pt“dÍ—p‚ƒAƒXƒyƒNƒg”äƒiƒm\‘¢ì»ŒŸ“¢","•\–Ê‹Zp‹¦‰ï‘æ150‰ñu‰‰‘å‰ï",,," 13A-10",,,2024,Sept. "Shigeki Nakagawa,Tongshuang Huang,Yota Takamura","Ultra-thin Electrodeposited CoPt Films for Three-dimensional Domain Wall Motion Memory (3D-DWMM)","NomaTech Mongolia 2024",,,,,,2024,July "Tongshuang Huang,Yota Takamura,Shinji Isogami,Takanori Shirokura,Yuta Saito,Md. Mahmudul Hasan,Mikiko Saito,Shinya Kasai,Shigeki Nakagawa","Detection and precise evaluation of spin-orbit torque in electrochemically deposited CoPt thin film with integrated harmonic Hall measurement","International Conference on Magnetism 2024",,," ICM20246.02264",,,2024,June "Tongshuang Huang,Yota Takamura,Shinji Isogami,Takanori Shirokura,Yuta Saito,Md. Mahmudul Hasan,Mikiko Saito,Shinya Kasai,Shigeki Nakagawa","Precise analysis of angle-dependent spin-orbit torque for electrodeposited CoPt thin film by integrating the low and high field second harmonic Hall measurements","The 71st JSAP Spring Meeting 2024","‘æ71‰ñ‰ž—p•¨—Šw‰ït‹GŠwpu‰‰‰ï u‰‰—\eW","The Japan Society of Applied Physics"," 23a-12D-4",,,2024,Mar. "Md. M. Hasan,T. Huang,M. Saito,Y. Takamura,D. Oshima,T. Kato,T. Homma","Preparation and Characterization of High Aspect Ratio Electrodeposited CoPt Multilayered Magnetic Nanowires","2023 IEEE International Magnetic Conference (INTERMAG)","2023 IEEE International Magnetic Conference (INTERMAG)",,,,"pp. 1-5",2023,Oct. "T. Huang,Y. Takamura,S Isogami,Y. Saito,M. M. Hasan,M. Saito,S. Kasai,S. Nakagawa","Second harmonic Hall measurement for CoPt thin film formed on highly oriented Pt layer with electrochemical deposition","The 84th JSAP Autumn Meeting 2023",,,,,,2023,Sept. "Md M. Hasan,T. Huang,M. Saito,Y. Takamura,T. Homma","Investigation of structural and magnetic properties of electrodeposited CoPt alloy nanowires for 3D magnetic memory application","The 47th Annual Conference on MAGNETISM in Japan",,,,,,2023,Sept. "Md. M. Hasan,T. Huang,M. Saito,Y. Takamura,T. Homma","High aspect ratio electrodeposited CoPt multilayered alloy nanowires for memory application","2023 ECSJ Fall Meeting",,,,,,2023,Sept. "Md. M. Hasan,T. Huang,M. Saito,Y. Takamura,T. Ono,T. Homma","CoPt Multilayred nanoswires: Preparation, Characterization and Application","11th International Symposium on Metallic Multilayers",,,,,,2023,July "T. Huang,Y. Takamura,M. Saito,Md. M. Hasan,S. Kasai,Y. Sonobe,S. Nakagawa","Development of Ultra-Thin CoPt Films With Electrodeposition for 3-D Domain Wall Motion Memory",,"IEEE Transactions on Magnetics","IEEE","Vol. 59","Issue 11","pp. 1-5",2023,July "Md M. Hasan,T. Huang,M. Saito,Y. Takamura,D. Ohsima,T. Kato,T. Homma","Electrodeposited CoPt multilayered-nanowire for 3D memory device","Intermag 2023","Intermag 2023 Digest Book",," XOC-05",,,2023,May "T. Huang,Y. Takamura,M. Saito,Md M. Hasan,S. Kasai,Y. Sonobe,S. Nakagawa","Development of Ultra-Thin CoPt Films with Electrodeposition for Three-Dimensional Domain Wall Motion Memory","Intermag2023",,," NPA-06",,,2023,May "Md M. Hasan,M. Saito,T. Huang,Y. Takamura,K. Yamada,D. Araki,S. Kasai,Y. Sonobe,D. Ohsima,T. Kato,S. Nakagawa,T. Ono,T. Homma","Preparation and evaluation of electrodeposited CoPt nanowires for 3D magnetic memory","The 147 Conf. The Surface Finishing Society in Japan","Abstract book for the 147th SFJ conf.",,,,,2023,Mar. "T. Huang,Y. Takamura,M. Saito,Md M. Hasan,D. Araki,T. Homma,S. Kasai,K. Yamada,Y. Sonobe,T. Ono,S. Nakagawa","Electrophoretically deposited CoPt film for realization of 3D domain wall motion memory","IEICE Technical Committee on Magnetic Recording & Information Storage (MRIS)","IEICE Tech. Rep.","THE INSTITUTE OF ELECTRONICS, INFORMATION AND COMMUNICATION ENGINEERS","vol. 122","no. 297","pp. 11-16",2022,Dec.