"Hisashi Sato,Nobuyuki Shishido,Shoji Kamiya,Kozo Koiwa,Masaki Omiya,Masahiro Nishida,Takashi Suzuki,Tomoji Nakamura,Takeshi Nokuo","Local distribution of residual stress of Cu in LSI interconnect",,"MaterialsLetters",,"Volume 136",,"Page 362-365",2014,Dec.
"Chuantong Chen,Kozo Koiwa,Nobuyuki Shishido,Shoji Kamiya,Masaki Omiya,Hisashi Sato,Masahiro Nishida,Takashi Suzuki,Tomoji Nakamura,Takeshi Nokuo,Tadahiro Nagasawa","Specimen size effect on elastic-plastic strength evaluation of interface between thin films",,"Eng. Fract. Mech.",,"Vol. 131",,"pp. 371-381",2014,Sept.
"Chuantong Chen,Nobuyuki Shishido,Shoji Kamiya,Kozo Koiwa,Hisashi Sato,Masaki Omiya,Masahiro Nishida,Takashi Suzuki,Tomoji Nakamura,Takeshi Nokuo,Toshiaki Suzuki","Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects",,"Microelectronic Engineering","Elsevier","Volume 120",,"Page 52-58",2014,May
"Nobuyuki Shishido,Yuka Oura,Hisashi Sato,Shoji Kamiya,Kozo Koiwa,Masaki Omiya,Masahiro Nishida,Takashi Suzuki,Tomoji Nakamura,Takeshi Nokuo,Toshiaki Suzuki","Crystal orientation effect on local adhesion strength of the interface between a damascene copper line and the insulation layer",,"Microelectronic Engineering","Elsevier","Volume 120",,"Page 71-76",2014,May
"Kentaro Kozuki,Masaki Omiya,KIKUO KISHIMOTO","Interfacial Strength Evaluation for Thin Film Coating Systems by Nanoindentation Test","The 4th Japan-Taiwan Workshop on Mechanical and Aerospace Engineering","The 4th Japan-Taiwan Workshop on Mechanical and Aerospace Engineering","The 4th Japan-Taiwan Workshop on Mechanical and Aerospace Engineering",,,"pp. 329-331",2007,Oct.