"Youichiro. Kurita,N. Motohashi,S. Matsui,K. Soejima,S. Amakawa,K. Masu,M. Kawano","SMAFTI Packaging Technology for New Interconnect Hierarchy","International Interconnect Technology Conference (IITC)","International Interconnect Technology Conference (IITC)","International Interconnect Technology Conference (IITC)",,,"pp. 220-222",2009,June