"Takashi Funakoshi,Hiroyuki Ryoson,Kosuke Suzuki,Katsunori Komehana,Tomoji Nakamura,Takayuki Ohba","9W/cm2/K Heat Transfer Coefficient Vapor Chamber for HPC Server Cooling Applications","2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)",,,,,,2023,Aug.
"Norio Chujo,Hiroyuki Ryoson,Koji Sakui,Shinji Sugatani,Tomoji Nakamura,Takayuki Ohba","Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing","2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)",,"IEEE",,,,2023,Aug.
"Norio Chujo,Koji Sakui,Shinji Sugatani,Hiroyuki Ryoson,Tomoji Nakamura,Takayuki Ohba","Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy","2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)",,,,,,2023,July
"T. Kudo,Y. Satake,T. Funaki,N. Araki,Z. Chen,T. Nakamura,T. Ohba","Study of High-Speed Bonding Process with Thin Adhesive for Chiplet Heterogenous Integration","2023 International Conference on Electronics Packaging (ICEP)",,,,,,2023,May
"武山 真弓,鹿島 光司,中村 友二,大場 隆之","工学的立場からの農業支援の一端",,"電子情報通信学会論文誌 C",,"Vol. J106-C","No. 6","pp. 242-248",2023,Feb.
"Yi-Chieh Tsai,Chia-Hsuan Lee,Hsin-Chi Chang,Jui-Han Liu,Han-Wen Hu,Hiroyuki Ito,Young Suk Kim,Takayuki Ohba,Kuan-Neng Chen","Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via",,"IEEE Transactions on Electron Devices",,"Vol. 68","No. 7","pp. 3520 - 3525",2021,July
"鹿島光司,伊藤浩之,深水克郎,大場隆之","月での米作りのための自動化・センシング技術",,"電子情報通信学会誌",,"Vol. 104","No. 2","pp. 123-129",2021,Feb.
"大場隆之,中村友二","３次元集積化技術の現状と将来展望",,"応用物理","応用物理学会","Vol. 89","No. 2","pp. 75",2020,Feb.
"Yi-Lun Yang,Hiroyuki Ito,Kim Youngsuk,Takayuki Ohba,Kuan-Neng Chen","Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3D Integration",,"IEEE Transactions on Components, Packaging and Manufacturing Technology",,,,,2020,Jan.
"Yi-Lun Yang,Jia-Ling Liu,Guan Wei Chen,Shoichi  Kodama,Kyosuke Kobinata,Kuan-Neng Chen,Hiroyuki Ito,Kim Youngsuk,Takayuki Ohba","Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation","International Conference on Electronics Packaging",,,,,"pp. 28-31",2019,Apr.
"伊藤浩之,鹿島 光司,深水 克郎,永野風矢,大場隆之","密閉型稲水耕栽培装置の試作と評価","農業環境工学関連学会2018年合同大会",,,,,,2018,Sept.
"伊藤浩之,石原昇,鹿島光司,深水克郎,道正志郎,大場隆之,益一哉","東京工業大学における農業プロジェクトの紹介","電子情報通信学会 集積回路研究専門委員会 集積回路技術リテラシー研究会",,,,,,2017,Oct.
"Koji Fujimoto,Yasuhiro Okawa,Yoshiomi Hiroi,Junko Katayama,Takashi Funakoshi,Yasuko Yanagida,Takayuki Ohba","A Silicon Bioreactor with Three-Dimensional Flow-Focusing Structure to Generate Platelets","The 21st International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS 2017)",,,,,,2017,Oct.
"伊藤浩之,石原昇,鹿島光司,深水克郎,大場隆之,益一哉","植物のキモチセンシングを目指したアグリエレクトロニクスの研究","電子情報通信学会 ソサイエティ大会",,,,,,2017,Sept.
"Yoriko Mizushima,Youngsuk Kim,Tomoji Nakamura,Akira Uedono,Takayuki Ohba","Behavior of copper contamination on backside damage for ultra-thin silicon three dimensional stacking structure",,"Microelectronic Engineering","ELSEVIER","Vol. 167",,"pp. 23-31",2017,Jan.
"Y. S. Kim,S. Kodama,Y. Mizushima,T. Nakamura,N. Maeda,K. Fujimoto,A. Kawai,T. Ohba","Warpage-free Ultra-Thinning ranged from 2 to 5-μm for DRAM Wafers and Evaluation of Devices Characteristics","2016 IEEE 66th Electronic Components and Technology Conference","Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th","IEEE",,,"pp. 1471-1476",2016,June
"Noriyuki Taoka,Osamu Nakatsuka,Yoriko Mizushima,Hideki Kitada,Young Suk Kim,Tomoji Nakamura,Takayuki Ohba,Shigeaki Zaima","Observation of lattice spacing fluctuation and strain undulation around through-Si vias in wafer-on-wafer structures using X-ray microbeam diffraction",,"Japanese Journal of Applied Physics",,"Volume 53",,,2014,Apr.
"Mizushima Yoriko,Kim Youngsuk,Nakamura Tomoji,Sugie Ryuichi,Hashimoto Hideki,Uedono Akira,Ohba Takayuki","Impact of back-grinding-induced damage on Si wafer thinning for three-dimensional integration",,"Jpn. J. Appl. Phys.","Institute of Physics","Vol. 53","No. 5",,2014,Apr.
"Akira Uedono,Yoriko Mizushima,Youngsuk Kim,Tomoji Nakamura,Takayuki Ohba,Nakaaki Yoshihara,Nagayasu Oshima,Ryoichi Suzuki","Vacancy-type defects induced by grinding of Si wafers studied by monoenergetic",,"Journal of Applied Physics","AIP","Vol. 116","  134501",,2014,