"Minoru Egawa,Tadashi Ishida,Laurent Jalabert,Hiroyuki Fujita","In-situ realtime monitoring of nanoscale gold electroplating using micro-electro-mechanical systems liquid cell operating in transmission electron microscopy",,"Applied Physics Letters","American Institute of Physics","Vol. 108",,,2016,Jan.
"Yuki Takayama,Tadashi Ishida,Takaaki Sato,Laurent Jalabert,Hiroyuki Fujita","Study of Viscous Deformation of SiO2 by Nanoscale Tensile Test under In-situ Observation","28th International Microprocesses and Nanotechnology Conference",,,,,,2014,Nov.
"Takaaki Sato,Tadashi Ishida,Shinsuke Nabeya,Laurent Jalabert,Hiroyuki Fujita","MEMS combined with TEM Setup for Nanotribology","The 23rd ASME Annual Conference on Information Storage and Process Systems",,,,,,2013,June
"Takaaki Sato,Tadashi Ishida,Laurent Jalabert,Hiroyuki Fujita","Real-time transmission electron microscope observation of nanofriction at a single Ag asperity",,"Nanotechnology","IOP","Vol. 23",,,2012,Nov.
"Laurent Jalabert,Takaaki Sato,Tadashi Ishida,Guillou Herve,Minoru Egawa,Shinsuke Nabeya,Yuki Takayama,Sebastian Volz,Hiroyuki Fujita","Toward a Lab-in-a-TEM by mounting advanced-MEMS in TEM holder","38th International conference on Micro and Nano Eengineering",,,,,,2012,Sept.
"Masataka Usami,Tadashi Ishida,Momoko Kumemura,Laurent Jalabert,Collard Dominique,Hiroyuki Fujita","Four-Terminal Electrical Measurement of a DNA Molecular Bundle Captured by MEMS Tweezers",,"IEEJ Transactions on Sensors and Micromachines","IEEJ","Vol. 133",,"pp. 98-99",2012,Sept.
"Laurent Jalabert,Takaaki Sato,Tadashi Ishida,Hiroyuki Fujita","Ballistic Thermal Conductance of a Lab-in-a-TEM Made Si Nanojunction",,"Nano Letters","American Chemical Society","Vol. 12",,"pp. 5213-5217",2012,Sept.
"Laurent Jalabert,Takaaki Sato,Tadashi Ishida,Chalopin Yann,Volz Sevaschan","Ballistic Phonon Transport in Nanowires at Ambient Temperature","Phonon 2012",,,,,,2012,July
"Tadashi Ishida,Laurent Jalabert,Hiroyuki Fujita","In-situ observation of formation of eutectic structures between gold and silicon","3rd IEEE Workshop on Low Temperature Bonding for 3D Integration",,,,,,2012,May