"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Hideki Yagi,Masato Furukawa,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer",,"Japanese Journal of Applied Physics",,"Vol. 59",,"p. SBBD02",2020,May
"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Hideki Yagi,Masato Furukawa,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer",,"Japanese Journal of Applied Physics",,"Volume 59","Number SB","pp. SBBD02-1",2019,Dec.