"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Hideki Yagi,Masato Furukawa,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer",,"Japanese Journal of Applied Physics",,"Vol. 59",,"p. SBBD02",2020,May
"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Hideki Yagi,Masato Furukawa,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Enhanced bonding strength of InP/Si chip-on-wafer by plasma-activated bonding using stress-controlled interlayer",,"Japanese Journal of Applied Physics",,"Volume 59","Number SB","pp. SBBD02-1",2019,Dec.
"菊地 健彦,白 柳,御手洗 拓矢,八木 英樹,新田 俊之,古川 将人,雨宮 智宏,西山 伸彦","引張り歪層によるSi基板上InP小片接合界面の垂直応力抑制","第80回応用物理学会秋季学術講演会",,,,,,2019,Sept.
"N. Nishiyama,K. Ohira,L. Bai,Y. Kurita,H. Furuyama,M. Inamura,T. Abe,T. Mitarai,K. Morita,S. Arai","Thin Film Optical Characteristics of InP/Si Hybrid Wafers by Chip-on-Wafer Direct Transfer Bonding Technology","Compound Semiconductor Week 2019",,,,,"p. MoP-D-13",2019,May
"Takehiko Kikuchi,Liu Bai,Takuya Mitarai,Hideki Yagi,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration","2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2019)",,,,,,2019,May
"白 柳,菊地 健彦,御手洗 拓矢,西山 伸彦,八木 英樹,雨宮 智宏,荒井 滋久","Investigation of stress dependence on bonding strength for III-V/Si chip-on-wafer by plasma activated bonding","第66回応用物理会春季学術講演会",,,,,,2019,Mar.
"御手洗 拓矢,MOATAZShaher Anis Mahmoud Eissa,宮嵜 隆之,立花 文人,白 柳,王 雨寧,雨宮 智宏,西山 伸彦,荒井 滋久","Si曲げ導波路による方向性光結合器を用いた広帯域ループミラーの作製","電子情報通信学会 光エレクトロニクス研究会",,,,,,2018,Dec.
"白 柳,菊地 健彦,御手洗 拓矢,西山 伸彦,八木 英樹,雨宮 智宏,荒井 滋久","Examination of Chip-on-Wafer Plasma Activated Bonding Technology for III-V on Si hybrid Photonic Integrated Circuits","電子情報通信学会 光エレクトロニクス研究会（OPE）","IEICE technical report",,"Vol. 118","No. 348","pp. 149-153",2018,Dec.
"Junichi Suzuki,Fumihito Tachibana,Kumi Nagasaka,Moataz S. A. M. Eissa,Liu Bai,Takuya Mitarai,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Highly efficient double-taper-type coupler between III-V/Silicon-on-insulator hybrid device and silicon waveguide",,"Japanese Journal of Applied Physics","Japan Society of Applied Physics","Vol. 57","No. 9","p. 094101",2018,Aug.
"Yuning Wang,Kumi Nagasaka,Junichi Suzuki,Liu Bai,Takuya Mitarai,Tomohiro Amemiya,Nobuhiko Nishiyama,Shigehisa Arai","Photoluminescence properties of GaInAs/InP layers by Ar fast atom beam for room temperature surface activated bonding toward hybrid PIC","Compound Semiconductor Week 2018",,,,,,2018,May
"鈴木 純一,立花 文人,永坂 久美,モータズ エイッサ,白 柳,御手洗 拓矢,雨宮 智宏,西山 伸彦,荒井 滋久","III-V/SOI ハイブリッドデバイス/Si 細線導波路間テーパ型モード変換器の構造評価","第65回応用物理学会春季学術講演会",,,"  18p-B203-7",,,2018,Mar.
"白 柳,菊地 健彦,鈴木 純一,永坂 久美,西山 伸彦,八木 英樹,雨宮 智宏,荒井滋久","III-V/Siハイブリッド部分直接接合における非破壊接合状況確認法の提案","応用物理学会 春季学術講演会",,,,,,2018,Mar.
"鈴木 純一,永坂 久美,モータズ エイッサ,立花 文人,白 柳,御手洗 拓矢,雨宮 智宏,西山 伸彦,荒井 滋久","III-V/SOIハイブリッドデバイスとSi導波路接続用テーパ型モード変換器構造の検討","電子情報通信学会 LQE・OPE・OCS合同研究会",,,,,,2017,Oct.