@article{CTT100893469, author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda}, title = {Estimation of Heat Generation in Semiconductors by Inverse Heat Transfer Analysis}, journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology}, year = 2023, } @article{CTT100875342, author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda}, title = {Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards}, journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology}, year = 2022, } @article{CTT100851453, author = {篠田 卓也 and 安井 龍太 and ウウォンソブ and Karim Rasyid Karjadi and 中溝 裕紀 and 伏信 一慶 and 富村 寿夫}, title = {ボルト締結された平板間の接触熱抵抗に関する研究 (円弧状うねりによる接触熱抵抗の低減法の提案)}, journal = {Thermal Science and Engineering}, year = 2021, } @article{CTT100875335, author = {Z. Li and H. Haketa and K. Fushinobu and R. Yasui and T. Shinoda}, title = {In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement}, journal = {Microelectronics Reliability}, year = 2021, } @article{CTT100875337, author = {Z. Li and J.V. Thomsen Silveira and K. Fushinobu and H. Nakamizo and R. Yasui and T. Shinoda}, title = {Heat dissipation measurement of electronic component on PCB by means of external heater and heat flux sensor}, journal = {Transactions of The Japan Institute of Electronics Packaging}, year = 2021, } @inproceedings{CTT100915603, author = {橋本 一成 and 安井 龍太 and 稲葉 雅司 and 江上 孝夫 and 有賀 善紀 and 向山 大索 and 武井 春樹 and 伏信 一慶 and 篠田 卓也 and 近江 慶太}, title = {MBDを利用した放熱材料配置のロバスト設計}, booktitle = {自動車技術会2024年春季大会学術講演会予稿集}, year = 2024, } @inproceedings{CTT100915608, author = {SHEN Yuanting and 中溝 裕己 and 篠田 卓也 and 安井 龍太 and 伏信 一慶}, title = {伝熱計測による次世代自動車用電子機器発熱量の予測}, booktitle = {第61回日本伝熱シンポジウム講演論文集}, year = 2024, } @inproceedings{CTT100915606, author = {石井 宏武 and 松岡 宏行 and 伏信 一慶 and 篠田 卓也}, title = {車載用ECUジャンクション温度低減のための接触熱抵抗の予測}, booktitle = {第61回日本伝熱シンポジウム講演論文集}, year = 2024, } @inproceedings{CTT100915609, author = {橋本 一成 and 川上 遼 and 安井 龍太 and 松田 唯 and 伏信 一慶 and 篠田 卓也 and 近江 慶太}, title = {ECUの伝熱設計における機械学習と熱回路網法を併用した解析時間の短縮}, booktitle = {第61回日本伝熱シンポジウム講演論文集}, year = 2024, } @inproceedings{CTT100893476, author = {Xie Centian and K. Fushinobu and R. Yasui and T. Shinoda}, title = {Package’s Solder Crack Detection Technique by Thermal Resistance}, booktitle = {第60回日本伝熱シンポジウム講演論文集}, year = 2023, } @inproceedings{CTT100915394, author = {Xie Centian and Liu Yung Chi and 伏信 一慶 and R. Yasui and 篠田 卓也}, title = {Solder Crack Detection Technique of MLCC by Means of Thermal Resistance Measurement}, booktitle = {第60回日本伝熱シンポジウム講演論文集}, year = 2023, } @inproceedings{CTT100893473, author = {川上 遼 and 橋本 一成 and 安井 龍太 and 伏信 一慶 and 篠田 卓也}, title = {ECUにおける放熱材を応用した伝熱設計に関する研究}, booktitle = {第60回日本伝熱シンポジウム講演論文集}, year = 2023, } @inproceedings{CTT100893471, author = {橋本 一成 and 川上 遼 and 安井 龍太 and 武井 春樹 and 伏信 一慶 and 篠田 卓也 and 近江 慶太}, title = {半導体モデルを利用した放熱材料の最適配置}, booktitle = {自動車技術会2023年春季大会学術講演会予稿集}, year = 2023, } @inproceedings{CTT100893470, author = {稲葉 雅司 and 中溝 裕紀 and 土方 亘 and 大蔵 孝 and 安井 龍太 and 高原 弘樹 and 伏信 一慶 and 藤田 英明 and 篠田 卓也 and 近江 慶太}, title = {動的アクチュエータのモデリングによる発熱量損失算出の提案}, booktitle = {自動車技術会2023年春季大会学術講演会予稿集}, year = 2023, } @inproceedings{CTT100875373, author = {中溝 裕紀 and 安井 龍太 and 篠田 卓也 and 伏信 一慶 and 富村 寿夫}, title = {うねりやひずみを伴う金属個体間の接触熱抵抗の予測方法の提案}, booktitle = {第59回日本伝熱シンポジウム講演論文集}, year = 2022, } @inproceedings{CTT100853574, author = {森崎裕樹 and 田中稔 and 竹内聡 and 新間敦 and 田中宏一 and 岡部沙也佳 and 篠田卓也 and 川口達也 and 齊藤卓志}, title = {結晶融解潜熱測定による射出成形PPS平板の板厚さ方向における冷却速度推定}, booktitle = {成形加工'21}, year = 2021, } @inproceedings{CTT100851457, author = {中溝 裕紀 and J.V. Thomsen Silveira and 伏信 一慶 and 篠田 卓也}, title = {非定常熱流検出による電子部品の消費電力計測手法の提案 − 熱流センサによる非破壊高速検出手法}, booktitle = {第58回日本伝熱シンポジウム講演論文集}, year = 2021, } @inproceedings{CTT100851454, author = {中溝 裕紀 and ウウォンソブ and Karim Rasyid Karjadi and 安井 龍太 and 篠田 卓也 and 伏信 一慶 and 富村 寿夫}, title = {ECU車両組付け時における接触熱抵抗の低減手法及び予測方法の提案}, booktitle = {自動車技術会2021年春季大会学術講演会予稿集}, year = 2021, } @inproceedings{CTT100851455, author = {篠田 卓也 and 平松 聖史 and Y. Liu and 安井 龍太 and 伏信 一慶}, title = {はんだ接続部の微細疲労き裂測定技術の開発 − 熱抵抗によるダイオードのはんだクラックの検出}, booktitle = {第58回日本伝熱シンポジウム講演論文集}, year = 2021, } @inproceedings{CTT100851456, author = {安井 龍太 and Y. Liu and 篠田 卓也 and 伏信 一慶}, title = {はんだ接続部の微細疲労き裂測定技術の開発 − チップコンデンサのはんだクラック非破壊検出}, booktitle = {第58回日本伝熱シンポジウム講演論文集}, year = 2021, } @inproceedings{CTT100851438, author = {篠田 卓也 and 伏信 一慶 and 牧 裕章 and Y. Liu and 安井 龍太 and 中溝 裕紀}, title = {過渡熱抵抗でのはんだクラック率測定}, booktitle = {第57回日本伝熱シンポジウム講演論文集}, year = 2020, } @inproceedings{CTT100816026, author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda}, title = {Transient thermal response investigation of multiple heat-source electronic systems}, booktitle = {Proc. ISTP30}, year = 2019, } @inproceedings{CTT100816051, author = {T. Shinoda and R. Yasui and W. Woo and K. Fushinobu and T. Tomimura}, title = {Influence of two screw fastening distances on contact thermal resistance}, booktitle = {Proc. ISTP30}, year = 2019, } @inproceedings{CTT100816027, author = {H. Maki and K. Fushinobu and R. Yasui and T. Shinoda}, title = {Non-destructive Diagnosis of solder Joint Failure by Means of Thermal Resistance Measurement}, booktitle = {Proc. ISTP30}, year = 2019, } @inproceedings{CTT100816025, author = {Z. Li and J.V. Thomsen Silveira and K. Fushinobu and R. Yasui and T. Shinoda}, title = {Heat dissipation measurement of multiple electronic components on ECU by means of external heater and heat flux sensor}, booktitle = {Proc. ISTP30}, year = 2019, } @inproceedings{CTT100815569, author = {J.V. Thomsen Silveira and Z. Li and B. Yang and R. Yasui and T. Shinoda and K. Fushinobu}, title = {Analysis of heat transfer from a heat dissipating device on a substrate}, booktitle = {Proc. ITherm2019}, year = 2019, } @inproceedings{CTT100815572, author = {篠田 卓也 and 安井 竜太 and K. Karjadi and 伏信 一慶 and 富村 寿夫}, title = {大きなうねりを有する固体間の接触熱抵抗の測定手法}, booktitle = {第56回日本伝熱シンポジウム講演論文集}, year = 2019, } @inproceedings{CTT100815571, author = {Z. Li and J.V. Thomsen Silveira and K. Fushinobu and R. Yasui and T. Shinoda}, title = {Heat dissipation measurement of electronic component by means of external heater and heat flux sensor}, booktitle = {第56回日本伝熱シンポジウム講演論文集}, year = 2019, } @inproceedings{CTT100815570, author = {J.V. Thomsen Silveira and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda}, title = {3D thermal analysis on PCBs with multiple surface mounted semiconductor devices by using an FEM-mased open source PDE solver}, booktitle = {第56回日本伝熱シンポジウム講演論文集}, year = 2019, } @inproceedings{CTT100789786, author = {J.V. Thomsen Silveira and B. Yang and Z. Li and K. Fushinobu and R. Yasui and T. Shinoda}, title = {Heat dissipation measurement technique of semiconductor devices on printed circuit board by using heat flow sensor}, booktitle = {日本機械学会熱工学コンファレンス2018講演論文集}, year = 2018, } @inproceedings{CTT100771151, author = {Hiroyuki Haketa and Zi Di Li and KAZUYOSHI FUSHINOBU and 安井 竜太 and Takuya Shinoda}, title = {In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement}, booktitle = {第55回日本伝熱シンポジウム講演論文集}, year = 2018, } @inproceedings{CTT100771156, author = {H. Haketa and M. Reininger and K. Fushinobu and H. Nakamizo and R. Yasui and T. Shinoda}, title = {In-situ Diagnosis of Solder Joint Failure by Means of Thermal Resistance Measurement}, booktitle = {}, year = 2017, }