@article{CTT100582343,
  author = {Masaki Omiya and Miyazaki Takeshi and KIKUO KISHIMOTO and Masazumi  Amagi},
  title = {Effect of Nickel Pad Metallization Thickness on Fatigue Failure of BGA Lead-Free Solder Joint},
  journal = {IEEE Tranzaction on Components and Packaging Technologies},
  year = 2008,
}