@article{CTT100908500,
  author = {武山 真弓 and 鹿島 光司 and 中村 友二 and 大場 隆之},
  title = {工学的立場からの農業支援の一端},
  journal = {電子情報通信学会論文誌 C},
  year = 2023,
}

@article{CTT100874041,
  author = {Yi-Chieh Tsai and Chia-Hsuan Lee and Hsin-Chi Chang and Jui-Han Liu and Han-Wen Hu and Hiroyuki Ito and Young Suk Kim and Takayuki Ohba and Kuan-Neng Chen},
  title = {Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via},
  journal = {IEEE Transactions on Electron Devices},
  year = 2021,
}

@article{CTT100843204,
  author = {鹿島光司 and 伊藤浩之 and 深水克郎 and 大場隆之},
  title = {月での米作りのための自動化・センシング技術},
  journal = {電子情報通信学会誌},
  year = 2021,
}

@article{CTT100820708,
  author = {Yi-Lun Yang and Hiroyuki Ito and Kim Youngsuk and Takayuki Ohba and Kuan-Neng Chen},
  title = {Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3D Integration},
  journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year = 2020,
}

@article{CTT100738469,
  author = {Yoriko Mizushima and Youngsuk Kim and Tomoji Nakamura and Akira Uedono and Takayuki Ohba},
  title = {Behavior of copper contamination on backside damage for ultra-thin silicon three dimensional stacking structure},
  journal = {Microelectronic Engineering},
  year = 2017,
}

@article{CTT100741616,
  author = {Noriyuki Taoka and Osamu Nakatsuka and Yoriko Mizushima and Hideki Kitada and Young Suk Kim and Tomoji Nakamura and Takayuki Ohba and Shigeaki Zaima},
  title = {Observation of lattice spacing fluctuation and strain undulation around through-Si vias in wafer-on-wafer structures using X-ray microbeam diffraction},
  journal = {Japanese Journal of Applied Physics},
  year = 2014,
}

@article{CTT100738462,
  author = {Mizushima Yoriko and Kim Youngsuk and Nakamura Tomoji and Sugie Ryuichi and Hashimoto Hideki and Uedono Akira and Ohba Takayuki},
  title = {Impact of back-grinding-induced damage on Si wafer thinning for three-dimensional integration},
  journal = {Jpn. J. Appl. Phys.},
  year = 2014,
}

@article{CTT100741620,
  author = {Akira Uedono and Yoriko Mizushima and Youngsuk Kim and Tomoji Nakamura and Takayuki Ohba and Nakaaki Yoshihara and Nagayasu Oshima and Ryoichi Suzuki},
  title = {Vacancy-type defects induced by grinding of Si wafers studied by monoenergetic},
  journal = {Journal of Applied Physics},
  year = 2014,
}

@inproceedings{CTT100908495,
  author = {Norio Chujo and Hiroyuki Ryoson and Koji Sakui and Shinji Sugatani and Tomoji Nakamura and Takayuki Ohba},
  title = {Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908498,
  author = {Takashi Funakoshi and Hiroyuki Ryoson and Kosuke Suzuki and Katsunori Komehana and Tomoji Nakamura and Takayuki Ohba},
  title = {9W/cm2/K Heat Transfer Coefficient Vapor Chamber for HPC Server Cooling Applications},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908496,
  author = {Norio Chujo and Koji Sakui and Shinji Sugatani and Hiroyuki Ryoson and Tomoji Nakamura and Takayuki Ohba},
  title = {Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100908499,
  author = {T. Kudo and Y. Satake and T. Funaki and N. Araki and Z. Chen and T. Nakamura and T. Ohba},
  title = {Study of High-Speed Bonding Process with Thin Adhesive for Chiplet Heterogenous Integration},
  booktitle = {},
  year = 2023,
}

@inproceedings{CTT100820715,
  author = {Yi-Lun Yang and Jia-Ling Liu and Guan Wei Chen and Shoichi  Kodama and Kyosuke Kobinata and Kuan-Neng Chen and Hiroyuki Ito and Kim Youngsuk and Takayuki Ohba},
  title = {Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation},
  booktitle = {},
  year = 2019,
}

@inproceedings{CTT100772037,
  author = {伊藤浩之 and 鹿島 光司 and 深水 克郎 and 永野風矢 and 大場隆之},
  title = {密閉型稲水耕栽培装置の試作と評価},
  booktitle = {},
  year = 2018,
}

@inproceedings{CTT100754350,
  author = {伊藤浩之 and 石原昇 and 鹿島光司 and 深水克郎 and 道正志郎 and 大場隆之 and 益一哉},
  title = {東京工業大学における農業プロジェクトの紹介},
  booktitle = {},
  year = 2017,
}

@inproceedings{CTT100772071,
  author = {Koji Fujimoto and Yasuhiro Okawa and Yoshiomi Hiroi and Junko Katayama and Takashi Funakoshi and Yasuko Yanagida and Takayuki Ohba},
  title = {A Silicon Bioreactor with Three-Dimensional Flow-Focusing Structure to Generate Platelets},
  booktitle = {},
  year = 2017,
}

@inproceedings{CTT100754351,
  author = {伊藤浩之 and 石原昇 and 鹿島光司 and 深水克郎 and 大場隆之 and 益一哉},
  title = {植物のキモチセンシングを目指したアグリエレクトロニクスの研究},
  booktitle = {},
  year = 2017,
}

@inproceedings{CTT100738574,
  author = {Y. S. Kim and S. Kodama and Y. Mizushima and T. Nakamura and N. Maeda and K. Fujimoto and A. Kawai and T. Ohba},
  title = {Warpage-free Ultra-Thinning ranged from 2 to 5-μm for DRAM Wafers and Evaluation of Devices Characteristics},
  booktitle = {Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th},
  year = 2016,
}

@misc{CTT100821996,
  author = {大場隆之 and 中村友二},
  title = {３次元集積化技術の現状と将来展望},
  year = 2020,
}

@misc{CTT100926168,
  author = {大場隆之 and 菅谷　慎二},
  title = {チップ放熱面積を拡大する方法と構造と製造方法},
  howpublished = {公開特許},
  year = 2024,
  month  = {},
  note   = {特願2022-193837(2022/12/02), 特開2024-080538(2024/06/13)}
}


@misc{CTT100925102,
  author = {大場隆之 and 作井　康司 and 福田　匡志 and 中條　徳男 and 菅谷　慎二},
  title = {積層チップおよび積層チップの製造方法},
  howpublished = {公開特許},
  year = 2024,
  month  = {},
  note   = {特願2022-171014(2022/10/25), 特開2024-062874(2024/05/10)}
}


@misc{CTT100925106,
  author = {大場隆之 and 作井　康司 and 中條　徳男 and 菅谷　慎二},
  title = {半導体装置および半導体装置の製造方法},
  howpublished = {公開特許},
  year = 2024,
  month  = {},
  note   = {特願2022-171012(2022/10/25), 特開2024-062873(2024/05/10)}
}


@misc{CTT100903901,
  author = {大場隆之 and 中條　徳男},
  title = {積層メモリ},
  howpublished = {公開特許},
  year = 2023,
  month  = {},
  note   = {特願2021-197979(2021/12/06), 特開2023-083955(2023/06/16)}
}


@misc{CTT100900361,
  author = {大場隆之 and 作井　康司},
  title = {半導体装置},
  howpublished = {公開特許},
  year = 2023,
  month  = {},
  note   = {特願2021-153314(2021/09/21), 特開2023-045099(2023/04/03)}
}


@misc{CTT100900356,
  author = {大場隆之 and 菅谷　慎二　},
  title = {積層デバイスの製造方法、および、積層デバイス},
  howpublished = {公開特許},
  year = 2023,
  month  = {},
  note   = {特願2021-159670(2021/09/29), 特開2023-049739(2023/04/10)}
}


@misc{CTT100892288,
  author = {大場隆之 and 菅谷　慎二},
  title = {半導体装置},
  howpublished = {公開特許},
  year = 2023,
  month  = {},
  note   = {特願2021-113963(2021/07/09), 特開2023-010103(2023/01/20)}
}


@misc{CTT100885389,
  author = {大場隆之},
  title = {半導体装置及びその製造方法},
  howpublished = {公開特許},
  year = 2022,
  month  = {},
  note   = {特願2021-067855(2021/04/13), 特開2022-162831(2022/10/25)}
}


@misc{CTT100883381,
  author = {大場隆之},
  title = {半導体装置及びその製造方法},
  howpublished = {公開特許},
  year = 2022,
  month  = {},
  note   = {特願2020-217061(2020/12/25), 特開2022-102371(2022/07/07)}
}


@misc{CTT100883377,
  author = {大場隆之},
  title = {半導体装置及びその製造方法},
  howpublished = {公開特許},
  year = 2022,
  month  = {},
  note   = {特願2020-217060(2020/12/25), 特開2022-102370(2022/07/07)}
}


@misc{CTT100865141,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置および半導体装置の製造方法},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2020-038816(2020/03/06), 特開2021-141238(2021/09/16), 特許第7411959号(2023/12/28)}
}


@misc{CTT100865146,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置とその製造方法},
  howpublished = {登録特許},
  year = 2024,
  month  = {},
  note   = {特願2020-038818(2020/03/06), 特開2021-141240(2021/09/16), 特許第7424580号(2024/01/22)}
}


@misc{CTT100865166,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置とその制御方法},
  howpublished = {公開特許},
  year = 2021,
  month  = {},
  note   = {特願2020-038815(2020/03/06), 特開2021-140555(2021/09/16)}
}


@misc{CTT100865155,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置の製造方法},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2020-038817(2020/03/06), 特開2021-141239(2021/09/16), 特許第7357288号(2023/09/28)}
}


@misc{CTT100864136,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2020-005051(2020/01/16), 特開2021-114347(2021/08/05), 特許第7340178号(2023/08/30)}
}


@misc{CTT100862930,
  author = {大場隆之 and 菅谷　慎二　},
  title = {３次元デバイスおよび３次元デバイスを製造する方法},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-234428(2019/12/25), 特開2021-103735(2021/07/15), 特許第7403765号(2023/12/15)}
}


@misc{CTT100860426,
  author = {大場隆之 and 作井　康司},
  title = {半導体装置},
  howpublished = {公開特許},
  year = 2021,
  month  = {},
  note   = {特願2019-190110(2019/10/17), 特開2021-064762(2021/04/22)}
}


@misc{CTT100860422,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {公開特許},
  year = 2021,
  month  = {},
  note   = {特願2019-190528(2019/10/17), 特開2021-068737(2021/04/30)}
}


@misc{CTT100860423,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-183712(2019/10/04), 特開2021-061292(2021/04/15), 特許第7272587号(2023/05/01)}
}


@misc{CTT100860431,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-183605(2019/10/04), 特開2021-061078(2021/04/15), 特許第7282329号(2023/05/19)}
}


@misc{CTT100846520,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-167207(2019/09/13), 特開2021-044045(2021/03/18), 特許第7320227号(2023/07/26)}
}


@misc{CTT100842104,
  author = {大場隆之 and 作井　康司　},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-050060(2019/03/18), 特開2020-155473(2020/09/24), 特許第7255797号(2023/04/03)}
}


@misc{CTT100842085,
  author = {大場隆之 and 作井　康司},
  title = {半導体装置},
  howpublished = {登録特許},
  year = 2023,
  month  = {},
  note   = {特願2019-050061(2019/03/18), 特開2020-155474(2020/09/24), 特許第7222481号(2023/02/07)}
}


@misc{CTT100710299,
  author = {大場隆之},
  title = {半導体装置の製造方法},
  howpublished = {登録特許},
  year = 2019,
  month  = {},
  note   = {特願2014-187540(2014/09/16), 特開2016-062951(2016/04/25), 特許第6485897号(2019/03/01)}
}


@misc{CTT100700318,
  author = {大場隆之},
  title = {血小板産生デバイス及び血小板産生流路装置},
  howpublished = {公開特許},
  year = 2015,
  month  = {},
  note   = {特願2014-039729(2014/02/28), 特開2015-163060(2015/09/10)}
}


@misc{CTT100700312,
  author = {大場隆之},
  title = {半導体装置及びその製造方法},
  howpublished = {登録特許},
  year = 2018,
  month  = {},
  note   = {特願2014-039730(2014/02/28), 特開2015-164160(2015/09/10), 特許第6440291号(2018/11/30)}
}


@misc{CTT100696683,
  author = {大場隆之 and 金　永 and 荒井　一尚},
  title = {半導体装置及びその製造方法},
  howpublished = {登録特許},
  year = 2018,
  month  = {},
  note   = {特願2013-263014(2013/12/19), 特開2015-119111(2015/06/25), 特許第6360299号(2018/06/29)}
}


@misc{CTT100696689,
  author = {大場隆之 and 前田　展秀 and 荒井　一尚},
  title = {半導体装置及びその製造方法},
  howpublished = {登録特許},
  year = 2018,
  month  = {},
  note   = {特願2013-263013(2013/12/19), 特開2015-119110(2015/06/25), 特許第6393036号(2018/08/31)}
}


@misc{CTT100696681,
  author = {大場隆之 and 児玉　祥一　 and 荒井　一尚},
  title = {半導体装置の製造方法},
  howpublished = {登録特許},
  year = 2018,
  month  = {},
  note   = {特願2013-263012(2013/12/19), 特開2015-119109(2015/06/25), 特許第6341554号(2018/05/25)}
}