@article{CTT100741614,
  author = {Hisashi Sato and Nobuyuki Shishido and Shoji Kamiya and Kozo Koiwa and Masaki Omiya and Masahiro Nishida and Takashi Suzuki and Tomoji Nakamura and Takeshi Nokuo},
  title = {Local distribution of residual stress of Cu in LSI interconnect},
  journal = {MaterialsLetters},
  year = 2014,
}

@article{CTT100741611,
  author = {Chuantong Chen and Kozo Koiwa and Nobuyuki Shishido and Shoji Kamiya and Masaki Omiya and Hisashi Sato and Masahiro Nishida and Takashi Suzuki and Tomoji Nakamura and Takeshi Nokuo and Tadahiro Nagasawa},
  title = {Specimen size effect on elastic-plastic strength evaluation of interface between thin films},
  journal = {Eng. Fract. Mech.},
  year = 2014,
}

@article{CTT100741612,
  author = {Chuantong Chen and Nobuyuki Shishido and Shoji Kamiya and Kozo Koiwa and Hisashi Sato and Masaki Omiya and Masahiro Nishida and Takashi Suzuki and Tomoji Nakamura and Takeshi Nokuo and Toshiaki Suzuki},
  title = {Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects},
  journal = {Microelectronic Engineering},
  year = 2014,
}

@article{CTT100741613,
  author = {Nobuyuki Shishido and Yuka Oura and Hisashi Sato and Shoji Kamiya and Kozo Koiwa and Masaki Omiya and Masahiro Nishida and Takashi Suzuki and Tomoji Nakamura and Takeshi Nokuo and Toshiaki Suzuki},
  title = {Crystal orientation effect on local adhesion strength of the interface between a damascene copper line and the insulation layer},
  journal = {Microelectronic Engineering},
  year = 2014,
}