国際会議発表 (査読有り)

• Takayuki Hashimoto, Hirofumi Akagi. A Cu-Plate-Bonded System-in-Package (SiP) With Low Spreading Resistance of Topside Electrodes for Voltage Regulators, IEEE Transactions on Power Electronics, Vol. 25, No. 9, pp. 2310-2319, Sept. 2010.
• Takayuki Hashimoto, Hirofumi Akagi. A System-in-Package (SiP) With Mounted Input Capacitors for Reduced Parasitic Inductances in a Voltage Regulator, IEEE Transactions on Power Electronics, IEEE, Vol. 25, No. 3, pp. 731-740, Mar. 2010.

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