@book{CTT100683461,
  author = {Masato Sone and Tetsuya Shimizu and Nao Shinoda and Tso-Fu Mark Chang},
  title = {Chaper 9: Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte},
  publisher = {INTECH},
  year = 2015,
}

@article{CTT100668115,
  author = {Tetsuya Shimizu and Yuma Ishimoto and Tso-Fu Mark Chang and Hikaru Kinashi and Takashi Nagoshi and Tatsuo Sato and Masato Sone},
  title = {Cu Wiring into Nano-Scale Holes by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte with a Continuous Flow Reaction System},
  journal = {The Journal of Supercritical Fluids},
  year = 2014,
}

@article{CTT100666163,
  author = {曽根 正人 and TSO-FU MARK CHANG and 清水哲也},
  title = {超臨界二酸化炭素エマルションを用いためっき法における欠陥の抑制},
  journal = {表面技術},
  year = 2014,
}

@article{CTT100664921,
  author = {曽根正人 and Tso-Fu Mark Chang and 清水哲也},
  title = {環境調和型ゼロエミッション次世代半導体配線形成方法の開発},
  journal = {化学と工業},
  year = 2014,
}

@article{CTT100634498,
  author = {Tetsuya Shimizu and Nao Shinoda and Tso-Fu Mark Chang and Akinobu Shibata and Masato Sone},
  title = {Crystal growth on novel Cu electroplating using suspension of supercritical CO2 in electrolyte with Cu particles},
  journal = {Surface & Coating Technology},
  year = 2013,
}

@article{CTT100634927,
  author = {Tso-Fu Mark Chang and Tetsuya Shimizu and Chiemi Ishiyama and Masato Sone},
  title = {Effects of Pressure on Electroplating of Copper using Supercritical Carbon Dioxide Emulsified Electrolyte},
  journal = {Thin Solid Films},
  year = 2013,
}

@article{CTT100633640,
  author = {Nao Shinoda and Tetsuya Shimizu and Tso-Fu Mark Chang and Akinobu Shibata and Masato Sone},
  title = {Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles},
  journal = {Thin Solid Films},
  year = 2013,
}

@article{CTT100642543,
  author = {曽根正人 and 清水哲也 and Tso-Fu Mark Chang},
  title = {超臨界ナノプレーティング法の開発と超微細配線への応用},
  journal = {精密工学会誌},
  year = 2012,
}

@article{CTT100633995,
  author = {Nao Shinoda and Tetsuya Shimizu and Tso-Fu Mark Chang and Akinobu Shibata and Masato Sone},
  title = {Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles},
  journal = {Microelectronic Engineering},
  year = 2012,
}

@inproceedings{CTT100735875,
  author = {曽根 正人 and Chang Tso-Fu Mark and 陳 君怡 and 清水哲也},
  title = {超臨界二酸化炭素エマルションを用いた半導体銅配線プロセスの研究 (招待講演)},
  booktitle = {電気化学会第84回大会},
  year = 2017,
}

@inproceedings{CTT100665562,
  author = {Masato Sone and Tetsuya Shimizu and Tso-Fu Mark Chang and Nao Shinoda and Takashi Nagoshi and Tatsuo Sato},
  title = {Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte toward 3D Integrated Circuits (Invited Lecture)},
  booktitle = {IUMRS-ICEM 2014},
  year = 2014,
}

@inproceedings{CTT100658586,
  author = {Masato Sone and Tetsuya Shimizu and Tso-Fu Mark Chang and Yuma Ishimoto and Hikaru Kinashi and Takashi Nagoshi and Tatsuo Sato},
  title = {Nanoscale Wiring By Cu Electrodeposition in Supercritical Carbon Dioxide (Invited Lecture)},
  booktitle = {ECS},
  year = 2013,
}

@inproceedings{CTT100658139,
  author = {Yuma Ishimoto and Tetsuya Shimizu and Tso-Fu Mark Chang and Tatsuo Sato and Masato Sone},
  title = {Cu Wiring by Electrodeposition in supercritical CO2 Emulsified Electrolyte using Continuous flow reaction system},
  booktitle = {TACT2013},
  year = 2013,
}

@inproceedings{CTT100642334,
  author = {Masato Sone and Tetsuya Shimizu and Nao Shinoda and Tso-Fu Mark Chang},
  title = {Application of Electrodeposition using Supercritical Carbon Dioxide Emulsion into Integrated Circuit Technology (Invited Lecture)},
  booktitle = {TSCFA2012},
  year = 2012,
}

@inproceedings{CTT100640071,
  author = {Tetsuya Shimizu and Yuma Ishimoto and Tso-Fu Mark Chang and Tatsuo Sato and Masato Sone},
  title = {Continuous flow reaction system for nanoscale wiring by Cu electroplating using suspension of supercritical CO2 in electrolyte with Cu particles},
  booktitle = {38th International Conference on Micro and Nano Engineering, (MNE2012)},
  year = 2012,
}

@inproceedings{CTT100626020,
  author = {Nao Shinoda and Tetsuya Shimizu and Tso-Fu Mark Chang and Akinobu Shibata and Masato Sone},
  title = {Novel Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles},
  booktitle = {TACT2011,International Thin Film Conference},
  year = 2011,
}

@inproceedings{CTT100626019,
  author = {Masato Sone and Tetsuya Shimizu and Nao Shinoda and Tso-Fu Mark Chang and Akinobu Shibata},
  title = {Crystal growth on novel Cu electroplating using suspension of supercritical CO2 in electrolyte with Cu particles (Invited Lecture)},
  booktitle = {TACT2011,International Thin Film Conference},
  year = 2011,
}

@inproceedings{CTT100626581,
  author = {Mark Chang and Tetsuya Shimizu and CHIEMI ISHIYAMA and Masato Sone},
  title = {Effects of Pressure on Electroplating of Copper using Supercritical Carbon Dioxide},
  booktitle = {TACT2011,International Thin Film Conference},
  year = 2011,
}

@inproceedings{CTT100630169,
  author = {Nao Shinoda and Tetuya Shimizu and Tso-Fu Mark Chang and Akinobu Shibata and Masato Sone},
  title = {Cu electroplating reaction using suspension of supercritical carbon dioxide in electroplating solution with Cu particles},
  booktitle = {Taiwan Supercritical Fluid Association (TSCFA)},
  year = 2011,
}

@inproceedings{CTT100625613,
  author = {Nao Shinoda and Tetsuya Shimizu and Tso-Fu Mark Chang and Akinobu Shibata and Masato Sone},
  title = {Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles},
  booktitle = {},
  year = 2011,
}

@inproceedings{CTT100566318,
  author = {清水哲也 and 曽根正人 and 柴田曉伸 and 肥後矢吉 and 石山千恵美 and 田島久善 and 宋利国 and 曽根田栄悦},
  title = {超臨界ナノプレーティング法による半導体配線形成技術の開発},
  booktitle = {},
  year = 2008,
}

@inproceedings{CTT100551443,
  author = {清水哲也 and 曽根正人 and 柴田曉伸 and 肥後矢吉 and 石山千恵美 and 田島久善 and 宋利国 and 曽根田栄悦},
  title = {超臨界ナノプレーティング法による半導体配線形成技術の開発},
  booktitle = {},
  year = 2008,
}

@misc{CTT100693541,
  author = {清水哲也},
  title = {超臨界二酸化炭素サスペンションを用いた電解銅めっき法の研究},
  year = 2014,
}

@misc{CTT100693483,
  author = {清水哲也},
  title = {超臨界二酸化炭素サスペンションを用いた電解銅めっき法の研究},
  year = 2014,
}

@misc{CTT100693410,
  author = {清水哲也},
  title = {超臨界二酸化炭素サスペンションを用いた電解銅めっき法の研究},
  year = 2014,
}



@phdthesis{CTT100693541,
  author = {清水哲也},
  title = {超臨界二酸化炭素サスペンションを用いた電解銅めっき法の研究},
  school = {東京工業大学},
  year = 2014,
}

@phdthesis{CTT100693483,
  author = {清水哲也},
  title = {超臨界二酸化炭素サスペンションを用いた電解銅めっき法の研究},
  school = {東京工業大学},
  year = 2014,
}

@phdthesis{CTT100693410,
  author = {清水哲也},
  title = {超臨界二酸化炭素サスペンションを用いた電解銅めっき法の研究},
  school = {東京工業大学},
  year = 2014,
}