論文

• Tetsuya Shimizu, Yuma Ishimoto, Tso-Fu Mark Chang, Hikaru Kinashi, Takashi Nagoshi, Tatsuo Sato, Masato Sone. Cu Wiring into Nano-Scale Holes by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte with a Continuous Flow Reaction System, The Journal of Supercritical Fluids, Elsevier, Vol. 60, pp. 60-64, May 2014.
• 曽根 正人, TSO-FU MARK CHANG, 清水哲也. 超臨界二酸化炭素エマルションを用いためっき法における欠陥の抑制, 表面技術, 表面技術協会, Vol. 65, No. 4, pp. 167-171, Apr. 2014.
• 曽根正人, Tso-Fu Mark Chang, 清水哲也. 環境調和型ゼロエミッション次世代半導体配線形成方法の開発, 化学と工業, Vol. 65, No. 1, pp. 22-27, Jan. 2014.
• Tetsuya Shimizu, Nao Shinoda, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Crystal growth on novel Cu electroplating using suspension of supercritical CO2 in electrolyte with Cu particles, Surface & Coating Technology, Elsevier, Vol. 231, pp. 77-80, Aug. 2013.
• Tso-Fu Mark Chang, Tetsuya Shimizu, Chiemi Ishiyama, Masato Sone. Effects of Pressure on Electroplating of Copper using Supercritical Carbon Dioxide Emulsified Electrolyte, Thin Solid Films, Elsevier, Vol. 529, pp. 25-28, Jan. 2013.
• Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles, Thin Solid Films, Elsevier, Vol. 529, pp. 29-33, Jan. 2013.
• 曽根正人, 清水哲也, Tso-Fu Mark Chang. 超臨界ナノプレーティング法の開発と超微細配線への応用, 精密工学会誌, 精密工学会, Vol. 78, No. 12, pp. 1030-1033, Dec. 2012.
• Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles, Microelectronic Engineering, Elsevier, Vol. 97C, pp. 126-129, Aug. 2012.

著書

• Masato Sone, Tetsuya Shimizu, Nao Shinoda, Tso-Fu Mark Chang. Chaper 9: Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte, Electroplating of Nanostructure, INTECH, pp. 189-210, Dec. 2015.

国際会議発表 (査読有り)

• Masato Sone, Tetsuya Shimizu, Tso-Fu Mark Chang, Nao Shinoda, Takashi Nagoshi, Tatsuo Sato. Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte toward 3D Integrated Circuits (Invited Lecture), IUMRS-ICEM 2014, International Union of Materials Research Societies - International Conference on Electronic Materials, IUMRS-ICEM 2014, June 2014.
• Masato Sone, Tetsuya Shimizu, Tso-Fu Mark Chang, Yuma Ishimoto, Hikaru Kinashi, Takashi Nagoshi, Tatsuo Sato. Nanoscale Wiring By Cu Electrodeposition in Supercritical Carbon Dioxide (Invited Lecture), 224th ECS Meeting, ECS, Nov. 2013.
• Yuma Ishimoto, Tetsuya Shimizu, Tso-Fu Mark Chang, Tatsuo Sato, Masato Sone. Cu Wiring by Electrodeposition in supercritical CO2 Emulsified Electrolyte using Continuous flow reaction system, TACT2013, International Thin Films Conference, TACT2013, Oct. 2013.
• Masato Sone, Tetsuya Shimizu, Nao Shinoda, Tso-Fu Mark Chang. Application of Electrodeposition using Supercritical Carbon Dioxide Emulsion into Integrated Circuit Technology (Invited Lecture), TSCFA2012, pp. in press, Oct. 2012.
• Tetsuya Shimizu, Yuma Ishimoto, Tso-Fu Mark Chang, Tatsuo Sato, Masato Sone. Continuous flow reaction system for nanoscale wiring by Cu electroplating using suspension of supercritical CO2 in electrolyte with Cu particles, 38th International Conference on Micro and Nano Engineering, (MNE2012), 38th International Conference on Micro and Nano Engineering, (MNE2012), pp. P086-027, Sept. 2012.
• Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Novel Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles, TACT2011,International Thin Film Conference, TACT2011,International Thin Film Conference, p. A20110519008, Nov. 2011.
• Masato Sone, Tetsuya Shimizu, Nao Shinoda, Tso-Fu Mark Chang, Akinobu Shibata. Crystal growth on novel Cu electroplating using suspension of supercritical CO2 in electrolyte with Cu particles (Invited Lecture), TACT2011,International Thin Film Conference, TACT2011,International Thin Film Conference, p. 21, Nov. 2011.
• Mark Chang, Tetsuya Shimizu, CHIEMI ISHIYAMA, Masato Sone. Effects of Pressure on Electroplating of Copper using Supercritical Carbon Dioxide, TACT2011,International Thin Film Conference, TACT2011,International Thin Film Conference, p. A20110519006, Nov. 2011.
• Nao Shinoda, Tetuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Cu electroplating reaction using suspension of supercritical carbon dioxide in electroplating solution with Cu particles, Taiwan Supercritical Fluid Association (TSCFA), Taiwan Supercritical Fluid Association (TSCFA), Taiwan Supercritical Fluid Association (TSCFA), p. 20, Oct. 2011.
• Nao Shinoda, Tetsuya Shimizu, Tso-Fu Mark Chang, Akinobu Shibata, Masato Sone. Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles, 37th International Conference on Micro and Nano Engineering, (MNE2011), Elsevier, pp. in press, Sept. 2011.

国内会議発表 (査読有り)

• 曽根 正人, Chang Tso-Fu Mark, 陳 君怡, 清水哲也. 超臨界二酸化炭素エマルションを用いた半導体銅配線プロセスの研究 (招待講演), 電気化学会第84回大会, 電気化学会第84回大会, Mar. 2017.

国内会議発表 (査読なし・不明)

• 清水哲也, 曽根正人, 柴田曉伸, 肥後矢吉, 石山千恵美, 田島久善, 宋利国, 曽根田栄悦. 超臨界ナノプレーティング法による半導体配線形成技術の開発, 第55回応用物理学関係連合講演会, Mar. 2008.
• 清水哲也, 曽根正人, 柴田曉伸, 肥後矢吉, 石山千恵美, 田島久善, 宋利国, 曽根田栄悦. 超臨界ナノプレーティング法による半導体配線形成技術の開発, 化学工学会第73年会, Mar. 2008.

学位論文

• 超臨界二酸化炭素サスペンションを用いた電解銅めっき法の研究,  審査の要旨,  博士(工学),  東京工業大学,  2014/09/25,   
• 超臨界二酸化炭素サスペンションを用いた電解銅めっき法の研究,  論文要旨,  博士(工学),  東京工業大学,  2014/09/25,   
• 超臨界二酸化炭素サスペンションを用いた電解銅めっき法の研究,  本文,  博士(工学),  東京工業大学,  2014/09/25,   

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