論文

• Minoru Egawa, Tadashi Ishida, Laurent Jalabert, Hiroyuki Fujita. In-situ realtime monitoring of nanoscale gold electroplating using micro-electro-mechanical systems liquid cell operating in transmission electron microscopy, Applied Physics Letters, American Institute of Physics, Vol. 108, Jan. 2016.
• Takaaki Sato, Tadashi Ishida, Laurent Jalabert, Hiroyuki Fujita. Real-time transmission electron microscope observation of nanofriction at a single Ag asperity, Nanotechnology, IOP, Vol. 23, Nov. 2012.
• Masataka Usami, Tadashi Ishida, Momoko Kumemura, Laurent Jalabert, Collard Dominique, Hiroyuki Fujita. Four-Terminal Electrical Measurement of a DNA Molecular Bundle Captured by MEMS Tweezers, IEEJ Transactions on Sensors and Micromachines, IEEJ, Vol. 133, pp. 98-99, Sept. 2012.
• Laurent Jalabert, Takaaki Sato, Tadashi Ishida, Hiroyuki Fujita. Ballistic Thermal Conductance of a Lab-in-a-TEM Made Si Nanojunction, Nano Letters, American Chemical Society, Vol. 12, pp. 5213-5217, Sept. 2012.

国際会議発表 (査読有り)

• Yuki Takayama, Tadashi Ishida, Takaaki Sato, Laurent Jalabert, Hiroyuki Fujita. Study of Viscous Deformation of SiO2 by Nanoscale Tensile Test under In-situ Observation, 28th International Microprocesses and Nanotechnology Conference, Nov. 2014.
• Takaaki Sato, Tadashi Ishida, Shinsuke Nabeya, Laurent Jalabert, Hiroyuki Fujita. MEMS combined with TEM Setup for Nanotribology, The 23rd ASME Annual Conference on Information Storage and Process Systems, June 2013.
• Laurent Jalabert, Takaaki Sato, Tadashi Ishida, Guillou Herve, Minoru Egawa, Shinsuke Nabeya, Yuki Takayama, Sebastian Volz, Hiroyuki Fujita. Toward a Lab-in-a-TEM by mounting advanced-MEMS in TEM holder, 38th International conference on Micro and Nano Eengineering, Sept. 2012.
• Laurent Jalabert, Takaaki Sato, Tadashi Ishida, Chalopin Yann, Volz Sevaschan. Ballistic Phonon Transport in Nanowires at Ambient Temperature, Phonon 2012, July 2012.

国際会議発表 (査読なし・不明)

• Tadashi Ishida, Laurent Jalabert, Hiroyuki Fujita. In-situ observation of formation of eutectic structures between gold and silicon, 3rd IEEE Workshop on Low Temperature Bonding for 3D Integration, May 2012.

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