論文

• Hisashi Sato, Nobuyuki Shishido, Shoji Kamiya, Kozo Koiwa, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo. Local distribution of residual stress of Cu in LSI interconnect, MaterialsLetters, Volume 136, Page 362-365, Dec. 2014.
• Chuantong Chen, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Masaki Omiya, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Tadahiro Nagasawa. Specimen size effect on elastic-plastic strength evaluation of interface between thin films, Eng. Fract. Mech., Vol. 131, pp. 371-381, Sept. 2014.
• Chuantong Chen, Nobuyuki Shishido, Shoji Kamiya, Kozo Koiwa, Hisashi Sato, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Toshiaki Suzuki. Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects, Microelectronic Engineering, Elsevier, Volume 120, Page 52-58, May 2014.
• Nobuyuki Shishido, Yuka Oura, Hisashi Sato, Shoji Kamiya, Kozo Koiwa, Masaki Omiya, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Toshiaki Suzuki. Crystal orientation effect on local adhesion strength of the interface between a damascene copper line and the insulation layer, Microelectronic Engineering, Elsevier, Volume 120, Page 71-76, May 2014.

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